We service manufacturers and OEMs to take advantage of Power Gold technology. We support IC layout, Power Gold integration, testing, specifications, failure analysis, packaging and reliability assessments to speed from design to qualification.
Power Gold was co-developed with suppliers and was published at 2003 Pan Pacific Microelectronics Symposium¹. Gold was replaced by thin sputtered aluminum more than 30 years ago. Today, longer list of capabilities resulting from rediscovery, the reuse of ancient electroplated gold process plus innovative applications consultation list. Rebirth of thick gold metal as ball bondable pads allows the creation of new products.
Why rediscover electroplated gold and resolve technical problems? To speed products to market, contact us. We save you time, effort and money.
Publications and references:
- “Power Gold for 175C Tj-max”, J. Wang and B. Baird at SMTA Pan Pacific Microelectronics Symposium, Feb. 2003, pp241, download paper
- “Power Gold for reliable Higher Temperature ICs”, J. Wang at Harsh Environment Electronics Workshop, July 2004, Dearborn, MI, USA
- T. Hauck and J. Wang at 2003MicroCar, Leipzig, Germany.
About the founder:
James Wang worked 29 years in semiconductor industry. Began wafer processing at E. Fishkill, NY. James helped start-up 3 new wafer fabs at S. Portland, Maine, at Regensburg, Germany, and finally at Tempe, Arizona. James set-up an automated assembly and test line. James has been developing IC technologies along with suppliers under “asset-light business model”. James developed and coined Power Gold. He added new capabilities, tested and assessed reliability of different options. James is experienced, hands-on; providing personalized, confidential consultation to assist from custom design until production ramp-up.