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Over passivation metallization Power Gold enhances ICs and creates new products:

  •  Less cost
  •  No corrosion
  •  Fine pitch ball bonds
  •  Bond over active circuits
  •  High temperature reliability
  •  Wafer level burn-in (WLBI)
  •  Integrated gold inductors
  •  Integrated gold transformer
  •  On-chip mold lock to survive MSL1
  •  Tiny magnetic cores

Photos and details consultation list