Power Gold LLC

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Tiny magnetic core, Power Gold plus wirebonds allow integration of high Q inductor directly on top of ICs.   Magnetic core thickness plus wire loops are less than 250 microns tall to fit within 1mm thin molded packages.   Inductor XY dimensions: 1x2mm.   Depending upon switching frequency, proper core material is chosen.   Air core at GHz, NiZn ferrite at MHz, permalloy core as shown on photo or epoxy glob top can be provided.   We provide services to complete IC layout, to combine processes, to package and to evaluate integrated gold inductors.

SEM Photograph: 35 turns Gold Inductor with permalloy magnetic core achieves micro-llenry inductance

Comparison of 25 microns Au ball bonds onto gold vs aluminum pads by major Taiwanese packaging house

  Power Gold
Ball Shear		 Power Gold
Wire Pull		 Aluminum pad
Ball Shear		 Aluminum pad
Wire Pull
MAXIMUM (gm) 11.4 50.4 11.2 42.7
MINIMUM (gm) 9.7 39.4 8.4 33.8
AVERAGE (gm) 10.7 44.0 9.8 38.2
Standard Deviation 0.4 1.9 0.5 2.1
CPK 5.4 5.1 3.6 3.6
99.8% confidence level ball bonds onto Power Gold pads are stronger than to standard aluminum pads.   Wirebond parameters for Al pads are simply resued for bonding onto Power Gold pads.   If FAB and bond parameters were optimized, better quality and finer pitch can be achieve using gold pads.